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SEMI Series
Solder Ball Placement System CCGA Column Attachment System Chip Dust Removal System BGA Desoldering Rework System BGA Printing Press BGA Lead Free Reflow Oven
PCBA Rework Series
BGA Rework System Desoldering Rework System PCBA Grinding and Glue Removal System PTH Rework System LCR Laser Rework System Chip Placement System Hot Air Preheating System
Fully Automatic Printing Ball Placement System(on-line)

VT-560L

Fully Automatic Printing Ball Placement System(on-line)
Fully Automatic Wafer Ball Placement System(on-line)

VT-560LⅡ

Fully Automatic Wafer Ball Placement System(on-line)
Fully Automatic Ball Placement System(on-line)

VT-860A Series

Fully Automatic Ball Placement System(on-line)
Fully Automatic Laser Ball Placement System(on-line)

VT-870

Fully Automatic Laser Ball Placement System(on-line)
 Solder Ball Placement System

VT-870T

Fully Automatic Laser Ball Placement System(off-line)
Fully Automatic Printing Ball Placement System(off-line)

VT-860L Series

Fully Automatic Printing Ball Placement System(off-line)
Solder Ball Placement System(off-line)

VT-860M

Solder Ball Placement System(off-line)
Automatic Ball Placement System(off-line)

VT-860ML

Automatic Ball Placement System(off-line)
CCGA Column Attachment System

VT-850

CCGA Column Attachment System
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